Vacuum Assisted Reflow 在线式真空回流炉

Heller Industries has developed a vacuum module that inserts directly in its reflow oven line to meet rising demand of high volume, void free, automated inline soldering. This vacuum assisted reflow has been shown to reduce the voids in a solder joint by 99% and allows thermal profiles to be directly ported from non-vacuum reflow applications to

achieve low COO and high UPH.

Features 主要特点

Heller在线式真空回流炉可实现真空焊接的自动化规模量产，降低生产成本；

内置式真空模组，分五段精准抽取真空，实现无空洞焊接 (Void < 1％)；

可直接移植普通回流炉的温度曲线，曲线方便可调。

• Applies multi-zones to suit various thermal profile requirements

 多温区设计，更多温控点，满足不同温度曲线要求

• Able to achieve < 1% total void area spec

 有效消除空洞，总空洞面积可控制在1%以下

• Provides optimized cycle (average 30~60s) to achieve high UPH

 高效生产能力，平均生产节拍在30~60秒

• Utilizes advanced pumping package for fast pump down time

 高效无油真空泵机组，可实现最短降压时间

• Adopts high efficient flux collection system to eliminate flux condensation

 高效助焊剂回收系统，预防助焊剂残留